Semiconductor device

ABSTRACT

In a display device using a substrate having flexibility, a drop in reliability due to defects such as cracks in the case where a substrate is made to curve is controlled. A display device is provided including a first substrate having flexibility, the first substrate including a curved part, an organic film covering a first surface of the first substrate and a second surface opposing the first surface in the curved part; and a pixel part and a drive circuit part arranged on the first surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2016-034269, filed on Feb. 25,2016, the entire contents of which are incorporated herein by reference.

FIELD

One embodiment of the present invention is related to a substratestructure of a display device having flexibility.

BACKGROUND

A display device is disclosed in which an electroluminescent element orliquid crystal element is used as a display element and a circuit fordriving the display element is formed using a thin film transistor. Oneform of a display device is disclosed in which it is possible to bendand curve using a substrate having flexibility (for example, JapaneseLaid Open Patent Publication No. 2015-169711).

A display device includes a circuit element such as a thin filmtransistor or capacitor element and the like above a substrate, and awiring part connecting the circuit element. In addition, an organicinsulation film and inorganic insulation film buried between theselayers or an organic insulation film arranged above each electrode forexample is arranged on roughly the entire surface of a substrate. Here,when a substrate having flexibility is curved, stress is applied to athin film arranged above the substrate and defects such as cracks andthe like are produced which is a problem. That is, even if a substratehas flexibility, since a thin film such as an inorganic insulation filmand the like arranged thereupon does not always include the sameflexibility, defects such as cracks and the like are produced in thethin film when the flexible substrate is bent. For example, when defectssuch as cracks and the like are produced in an inorganic insulation filmabove a flexible substrate, water infiltrates from the defects andcauses degradation of a display element in a pixel region.

SUMMARY

According to one embodiment of the present invention, a display deviceis provided including a first substrate having flexibility, the firstsubstrate including a curved part, an organic film covering a firstsurface of the first substrate and a second surface opposing the firstsurface in the curved part; and a pixel part and a drive circuit partarranged on the first surface.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a planar view diagram showing a structure of a display devicerelated to the present embodiment;

FIG. 2 is a cross-sectional diagram showing a structure of a displaydevice related to the present embodiment and shows a structure along theline A-B shown in FIG. 1;

FIG. 3 is a cross-sectional diagram showing a structure of a displaydevice related to the present embodiment and shows a structure along theline C-D shown in FIG. 1;

FIG. 4 is a cross-sectional diagram showing a structure of a displaydevice related to the present embodiment and shows a state where asubstrate is curved in the structure along the line A-B shown in FIG. 1;

FIG. 5 is a cross-sectional diagram showing a structure of a displaydevice related to the present embodiment and shows a state where asubstrate is curved in the structure along the line A-B shown in FIG. 1;and

FIG. 6 is a cross-sectional diagram showing a structure of a displaydevice related to the present embodiment and shows a structure along theline C-D shown in FIG. 1.

DESCRIPTION OF EMBODIMENTS

One aim of an embodiment of the present invention is to control a dropin reliability due to defects such as cracks and the like even in thecase where a substrate is curved in a display device using a substratehaving flexibility.

The embodiments of the present invention are explained below whilereferring to the diagrams. However, it is possible to perform thepresent invention using various different forms, and the presentinvention should not be limited to the content described in theembodiments exemplified herein. Although the width, thickness and shapeof each component are shown schematically compared to their actual formin order to better clarify explanation, the drawings are merely anexample and should not limit an interpretation of the present invention.In addition, in the specification and each drawing, the same referencesymbols are attached to similar elements and elements that have beenmentioned in previous drawings, and therefore a detailed explanation maybe omitted where appropriate.

In the present specification, in the case where certain parts or regionsare given as [above (or below)] other parts or regions, as long as thereis no particular limitation, these include parts which are not onlydirectly above (or directly below) other parts or regions but also in anupper direction (or lower direction). That is, in the case where certainparts or regions are given as [above (or below)] other parts or regions,other structural elements may be included between other parts or regionsin an upper direction (or lower direction).

FIG. 1 shows a structure of a display device 100 related to oneembodiment of the present invention. In addition, in the display device100 shown in FIG. 1, a cross-sectional structure along the line A-B isshown in FIG. 2 and a cross-sectional structure along the line C-D isshown in FIG. 3. These diagrams are referred to in the explanationbelow.

The display device 100 includes a pixel part 104 arranged with a pixel106 in a first surface 10 of a first substrate 102. The display device100 includes a drive circuit part for driving the pixel 106 in a region(periphery region) on the exterior of the pixel 104 in the firstsubstrate 102. The drive circuit includes a first drive circuit 108which outputs a scanning signal and a second drive circuit 110 whichoutputs a video signal synchronized with the scanning signal. The seconddrive circuit 110 is a driver IC for example mounted above the firstsubstrate 102. In addition, a terminal part 112 which is input withsignals is arranged in a region on the exterior side of the firstsubstrate 102. The terminal part 112 includes a terminal which is inputwith a video signal. The terminal part 112 is electrically connected toa wiring substrate 118. The driver IC described above, that is, thesecond driver circuit 110, may be mounted above the wiring substrate118.

The first drive circuit 108, the second drive circuit 110 and the pixelpart 104 are connected via wiring. This connection region includeswiring formed from a conductive film and an insulation layer buried withthis wiring. In the present specification, this connection region in aregion between a pixel part and a drive circuit part is referred to as awiring part. The display device 100 includes a first wiring part 114between the pixel part 104 and the first drive circuit 108, and a secondwiring part 116 between the pixel part 104 and the second drive circuit110.

In the present embodiment, the first substrate 102 includes flexibility.A resin material is used for the first substrate 102 which includesflexibility. It is preferred that a high molecular material includingrecurring units of imide bonds is used as the resin material, polyimidefor example. Specifically, a film substrate with polyimide molded into asheet shape may be used as the first substrate 102. In addition, asanother form of the first substrate 102, it is possible to use a thinmetal substrate, a compound substrate in which a resin film is bonded toa thin metal substrate, or a compound substrate in which a resin film isbonded to a thin glass substrate.

The display device 100 is arranged with a sealing member 126 opposingthe first substrate 102. The sealing member 126 is also referred to as asecond substrate opposing the first substrate 102. The pixel part 104 iscovered by the sealing member 126. The sealing member 126 is formed froma cover film using a resin material or a sheet shaped component.

At least one part of the display device 100 includes a curved part 120.That is, by providing the first substrate 102 with flexibility, it ispossible to provide a bent state to at least a part of the displaydevice 100. The curved part 120 is a region in which the first substrate102 bends or curves. When the first substrate 102 curves, parts whichoverlap with at least the curved part 120 within the pixel part, thedrive circuit part and wiring part also curve together with the firstsubstrate 102.

The display device 100 is arranged with a support member 122 in a secondsurface 20 opposing the first surface 10 of the first substrate 102.Although the support member 122 is arranged so as to cover roughly theentire surface of the first substrate 102, a notch part 124 is alsoincluded in at least a part of the support member 122. The supportmember 122 which is arranged close to the first substrate 102essentially operates in the same way as increasing the thickness of asubstrate. That is, the support member 122 controls bending of the firstsubstrate 102. On the other hand, since the thickness of the firstsubstrate 102 is maintained by the notch part 124 of the support member122, the first substrate 102 may easily bend compared to regions wherethe support member 122 is arranged. A region of the first substrate 102corresponding to the notch part 124 of the support member 122 becomesthe curved part 120.

The support member 122 is formed from the same resin material as thefirst substrate 102 or a component which is harder than the firstsubstrate 102. A resin substrate formed from a silicon resin and thelike or a substrate such as an acrylic plate may be used as the supportmember 122. Furthermore, in the present embodiment, the support member122 is not an essential structural component but a structural componentwhich can be used appropriately. However, as described above, by usingthe support member 122, bending of the first substrate 102 iscontrolled, and by arranging the notch part 124, it is possible to setthe position of the curved part 120 of the display device 100.

The notch part 124 of the support member 122 can be arranged at anarbitrary position and an arbitrary width. FIG. 2 shows a form in whichthe notch part 124 of the display device 100 is arranged between thepixel part 104 and second drive circuit 110. In other words, a regionwhich overlaps with the second wiring part 116 of the display device 100shown in FIG. 2 becomes the curved part 120.

As is shown in FIG. 2 and FIG. 3, the display device 100 includes anorganic film 128 in a region including the curved part 120. The organicfilm 128 is arranged so as to cover an upper surface of the secondwiring part 116 in the first surface of the first substrate 102. Inother words, the organic film 128 is arranged in a region between thepixel part 104 and the second drive circuit part 110. The second wiringpart 116 is covered and protected by the organic film 128. The organicfilm 128 is also arranged on the side of the second surface 20 of thefirst substrate 102. In addition, the organic film 128 is arranged tocover a region between the first surface 10 and second surface 20 of thefirst substrate 102, that is, to cover a side surface part of the firstsubstrate 102. By arranging the organic film 128 in the first substrate102 in this way, it is possible to use the organic film 128 as aprotection film of the curved part 120. For example, even in the casewhere stress is concentrated on one part of the curved part 120 anddefects such as cracks occur in the second wiring part 116, by arrangingthe organic film 128 continuously in the first surface 10 and secondsurface 20 of the first substrate 102, it is possible to ensure thatdefects are not exposed to the air.

FIG. 4 shows a state of the display device 100 when the first substrate102 is made to curve in the curved part 120. The first substrate 102curves so that the second drive circuit 110 is arranged on the rearsurface side of the pixel part 104. Bending stress is applied to thecurved part 120 of the first substrate 102. For example, bending stressis applied to the second wiring part 116 when the first substrate 102 isbent. That is, bending stress is applied to wiring included in thesecond wiring part 116 and an insulation layer buried with this wiring.In this case, although a metal film which forms the wiring is resistantto bending due to flexibility, defects such as cracks occur since atleast an inorganic insulation layer among the insulation layers buriedwith the wiring is brittle. Defects such as cracks occurring in thesecond wiring part 116 proceed (grow) towards the pixel part 104.Supposing that defects such as cracks in the second wiring part 116 areexposed to the air, water and the like infiltrates to the pixel part 104from the cracks which affects reliability of the display device 100.

The display device 100 related to the present embodiment is arrangedwith the organic film 128 covering the second wiring part 116. As isshown in FIG. 3 and FIG. 4, the organic film 128 is not arranged in theentire region of the display device 100 but in a part of the displaydevice 100 which includes at least the curved part 120. In this part,the organic film 128 is arranged continuously in the first surface 10,second surface 20 and a side surface which intersects both the firstsurface 10 and second surface 20. In other words, the organic film 128is arranged across the entire periphery of one part of the displaydevice 100 including at least the curved part 120. Since the organicfilm 128 includes flexibility the same as the first substrate 102, theorganic film 128 has a high resistance to bending and it is difficultfor defects such as cracks to occur. The organic film 128 is alsoarranged along a curved surface of the first substrate 102 in the curvedpart 120. As a result, even if defects such as cracks occur in aninsulation layer of the second wiring part 116, such defects are notexposed to the exterior. In addition, the display device 100 includes apart (non-curved part) which is different to the curved part 120 and thenon-curved part includes a region in which the organic film 128 is notformed. That is, it is not the case that the organic film 128 isarranged continuously in the entire periphery (that is, all of the firstsurface 10, second surface 20 and side surface intersecting both thefirst surface 10 and second surface 20) of the display device 100.

Furthermore, by using a cover film with low moisture permeability (highresistance to gas or high moisture resistance) as the organic film 128,it is possible to maintain reliability of the display device 100 even ifdefects such as cracks occur in the second wiring part 116. It isdesirable that a material which has excellent non-moisture permeabilityproperties (gas barrier properties) and mechanical characteristics(resistance to bending) be used as the organic film 128.

It is preferred that polychloropyroxyline is used as the organic film128 or the organic film 128 contains polychloropyroxyline. Various typesof polychloropyroxyline are known that have different molecularstructures such as parylene C, parylene N and parylene D. Although anyone of parylene C, parylene N and parylene D may be used as the organicfilm 128, among these it is preferred that parylene C is used since itis has the highest resistance to moisture.

A polychloropyroxyline thin film as the organic film 128 can bemanufactured using a vacuum deposition method. A polychloropyroxylinethin film manufactured using a vacuum deposition method grows atmolecular units. As a result, regardless of the shape of a depositionsurface, it is possible to uniformly form a polychloropyroxyline thinfilm even in fine gaps. A polychloropyroxyline thin film can be formedusing a vacuum deposition method with a thickness from a few micrometersto a few tens of micrometers and it is possible to exhibit sealingcapabilities even at this thickness. Furthermore, when arranging theorganic film 128 in the curved part 12, a shadow mask including anaperture part corresponding to the curved part 120 of the firstsubstrate 102 may be used when forming the polychloropyroxyline thinfilm. By using a shadow mask when forming a film, it is possible toselectively grow a polychloropyroxyline thin film in the curved part 120without forming the organic film 128 in other regions such as the pixelpart 104.

In this way, according to one embodiment of the present invention, it ispossible to prevent a drop in reliability due to defects such as crackseven in the case where a substrate is curved in a display device using asubstrate having flexibility.

Next, details of the display device 100 related to the presentembodiment are explained while referring to FIG. 5 and FIG. 6. Across-sectional structure corresponding to the line A-B shown in FIG. 1is shown in FIG. 5 and a cross-sectional structure corresponding to theline C-D is shown in FIG. 6. Furthermore, FIG. 5 shows a state in whichthe display device 100 is bent by the curved part 120 and FIG. 6 shows across-sectional view of the curved part 120.

In the display device 100, the first substrate 102 is curved by thecurved part 120 and the second drive circuit 110 and terminal part 112are arranged on the rear surface side (second surface 20 side) of thepixel part 104. The second wiring part 116 is arranged between the pixelpart 104 and the second drive circuit 110. The second wiring part 116 isarranged along a curved surface of the curved part 120.

The pixel part 104 is arranged in the first surface 10 of the firstsubstrate 102. The example shown in FIG. 5 shows a form in which atransistor 130, light emitting element 132, first capacitor element 134and second capacitor element 136 are included in a pixel 106. The lightemitting element 132 is electrically connected with the transistor 130.The first capacitor element 134 stores a gate voltage of the transistor130 and the second capacitor element 136 is additionally arranged inorder to adjust the amount of current flowing to the light emittingelement 132. Furthermore, the pixel 106 shown in FIG. 5 is only anexample and a pixel may be formed by a transistor and a light emittingelement or by a transistor, light emitting element and a first capacitorelement. Alternatively, elements other than a transistor, light emittingelement and first capacitor element may also be added to form a pixel.

The transistor 130 includes a structure in which a semiconductor film138, gate insulation film 140 and gate electrode 142 are stacked. Asource/drain electrode 152 is arranged on an upper surface of the firstinsulation film 144. The source/drain electrode 152 contacts a sourceregion of the semiconductor film 138 or a region corresponding to adrain region for achieving electrical conduction. A second insulationfilm 146 is arranged as a planarized layer above the source/drainelectrode 152. In addition, the light emitting element 132 is arrangedabove the second insulation film 146. The first insulation film 144 isformed using an inorganic insulation material and the second insulationfilm 145 is formed using an organic insulation material as the structureof the pixel 104. The first capacitor element 134 is formed including aregion in which the semiconductor film 138 and a first capacitorelectrode 154 overlap using the gate insulation film 140 as a conductivefilm, and a region in which the source/drain electrode 152 and the firstcapacitor electrode 154 overlap using the gate insulation film 140 as aconductive film. The second capacitor element 136 is formed in a regionin which the first electrode 158 and second capacitor electrode 156overlap using a third insulation film 148 arranged above the secondinsulation film 146 as a conductive film. The third insulation film 148is formed from an inorganic insulation material such as silicon oxide,silicon nitride or silicon oxynitride.

The light emitting element 132 includes a structure in which the firstelectrode 158 (pixel electrode) electrically connected with thetransistor 140, light emitting layer 160, and second electrode 162(common electrode) are stacked. The light emitting element 132 controlsemitted light by controlling the potential between the first electrode158 and second electrode 162. The pixel part 104 includes a bank layer164 which covers a periphery edge of the first electrode 158 and exposesan interior region. The light emitting layer 160 is arranged across thebank layer 164 from an upper surface of the first electrode 158. Thesecond electrode 162 covers an upper surface of the light emitting layer160 and is arranged across roughly the entire surface of the pixel part104.

The light emitting layer 160 is a layer including an organicelectroluminescence material as a light emitting material. The lightemitting layer 160 is formed using a low molecular or high molecularorganic material. In the case where a low molecular material is used forthe light emitting layer 160, in addition to the light emitting layerwhich includes an organic material with light emitting properties, oneor a plurality of a hole injection layer, electron injection layer, holetransport layer and electron transport layer sandwiching the lightemitting layer may also be included. Since the light emitting layer 160degrades due to water, a fourth insulation film 150 is arranged abovethe second electrode 162. The fourth insulation film 150 is arranged onroughly the entire surface of the pixel part 104.

A single layer of or stacked layer body of an inorganic insulation filmsuch as silicon nitride, silicon oxide or aluminum oxide is used as thefourth insulation film 150. Furthermore, an insulation film comprisedfrom a stacked layer body of an organic insulation film and inorganicinsulation film may be arranged above the fourth insulation film 150. Asealing member 126 is arranged on an upper surface side of the fourthinsulation film 150. FIG. 5 shows the case where the sealing member 126is a sheet shaped substrate. In this case, the sealing member 126 isfixed to the first substrate 102 by a sealing material 172 whichencloses the outer periphery of the pixel part 104. Gaps are presentbetween the fourth insulation film 150 and sealing member 126 and thesegaps may be filled with a filler material. A resin material is used forthe filler material.

An aperture part 168 which splits the second insulation film 146 andbank layer 164 is included between an end part (region contacting thesealing material 172) of the pixel part 104 and a pixel 106. The thirdinsulation film 148 formed from an inorganic material and the secondelectrode 162 are arranged so as to cover a side surface and bottomsurface of the aperture part 168. In other words, a region is includedin which the third insulation film 148 and second electrode 162 contactin the aperture part 168. By adopting this type of structure, the lightemitting layer 160 is essentially enclosed and sealed by the thirdinsulation film 148 and second electrode 162. That is, by adopting thistype of sealing structure, water and the like is prevented from passingthrough the second insulation film 146 which is formed from an organicresin material and the bank layer 164, and infiltrating the lightemitting layer 160. In addition, the pixel part 104 is arranged with aconnection part 170 in which the second electrode 162 is electricallyconnected with lower layer wiring.

The first substrate 102 is arranged with first wiring 166 from the pixelpart 104 to the second drive circuit 110. A region in which the firstwiring 166 is arranged is also a region corresponding to the curved part120. For example, the first wiring 166 is formed in the same layer asthe source/drain electrode 152. For example, the first wiring 166includes a structure in which an aluminum film (Al) and a metal filmwith a high melting point such as titanium (Ti) or molybdenum (Mo) arestacked above and below the aluminum film. The third insulation film 148and fourth insulation film 150 arranged extending from the pixel part104 are stacked above the first wiring 166. Although the curved part 120exists in a region on the outer side of the sealing member 126, byarranging the third insulation film 148 and fourth insulation film 150,the first wiring 166 is protected by these insulation films and is neverexposed directly to the air.

The organic film 128 is arranged in the curved part 120. That is, theorganic film 128 is arranged in a region on the outer side of thesealing member 126. The organic film 128 is preferred to be arranged asthe outermost layer in the curved part 120. FIG. 5 includes a structurein which the gate insulation film 140, first insulation film 144, firstwiring 166, third insulation film 148 and fourth insulation film 150 arestacked above the first substrate 102 in the curved part 120.Furthermore, the organic film 128 is arranged above the fourthinsulation film 150.

When the first substrate 102 is curved, bending stress is applied to thesecond wiring part 116. At this time, since the first wiring 166 is ametal film, it is possible to be deform in response to bending of thesubstrate which is flexible. However, since the third insulation film148 and fourth insulation film 150 are formed from an inorganicmaterial, when the first substrate 102 is curved, defects such as cracksoccur due to brittleness. When defects such as cracks which occur inthese inorganic insulation films spread towards the pixel part 104,water and the like in the air infiltrates the pixel part 104 from thesedefects. For example, when the first substrate 102 is repeatedly bent bythe curved part 120, stress is repeatedly applied to the second wiringpart 116 and thereby defects such as cracks occurring in an inorganicinsulation film grow.

As described previously, a water blocking structure is adopted for thedisplay device 100 in which the third insulation film 148 and secondelectrode 162 are in close contact in the aperture part 168. As aresult, the display device 100 can to a certain extent prevent waterfrom infiltrating to the light emitting layer 160. However, a contacthole which electrically connects the first electrode 158 and thesource/drain electrode 152, and a contact hole which electricallyconnects the source/drain electrode 152 and the semiconductor film 138are arranged in a pixel 106. These contact holes are formed in the firstinsulation film 144 or second insulation film 146. Water and the likewhich infiltrates from the exterior to the pixel part 104 can form apath which infiltrates to a region in which the light emitting layer 160is arranged via a contact hole which passes through the first insulationfilm 144 or second insulation film 146. Due to this, degradation of alight emitting element 132 in the pixel part 104 occurs aftermanufacture of the display device 100 which leads to a decrease indisplay quality.

However, in the present embodiment, the organic film 128 covers the topof the fourth insulation film 150 in the curved part 120. As a result,it is possible to prevent defective parts from being exposed to the aireven when these defects such as cracks occur in either the gateinsulation film 140, first insulation film 144, third insulation film148 and fourth insulation film 150 which are inorganic insulation films.

Defects such as cracks which occur in the second wiring part 116 alsoeasily occur in an end part of the first substrate 102 where stress iseasily concentrated. However, as is shown in FIG. 6, by arranging theorganic film 128 to cover the entire periphery of the first substrate102, it is possible to ensure that defects are not exposed to the aireven when defects such as cracks occur in an end part of the firstsubstrate 102.

In addition, as is shown in FIG. 6, the second wiring 116 is mixed witha region in which the gate insulation film 140, first insulation film144, first wiring 166, third insulation film 148 and fourth insulationfilm 150 are stacked above the first substrate 102 from the firstsubstrate 102 side, and a region in which the gate insulation film 140,first insulation film 144, third insulation film 148 and fourthinsulation film 150 are stacked. Stress is concentrated in a boundarybetween these two regions when the first substrate 102 bends due to adifference in their stacked structures. For example, it is possible thatstress is concentrated in the third insulation film 148 which covers thefirst wiring 166. Even in this case, by arranging the organic film 128in an outermost layer, it is possible to prevent defective parts frombeing exposed to the air even when defects occur in the third insulationfilm 148.

Although a form is shown in the present embodiment in which the curvedpart 120 of the display device 100 is arranged in a region overlappingthe second wiring part 116, the present invention is not limited to thisstructure. For example, the curved part 120 may also be arranged tooverlap the first wiring substrate 114. In addition, the curved part 120may also be arranged to intersect the pixel part 104. In either case, byarranging the organic film 128 as an outermost layer in the curved part120 where the first substrate 102 bends, it is possible to increaseresistance to problems that can occur due to bending of the firstsubstrate 102.

Although a form is shown in the present embodiment in which the lightemitting element 132 is arranged in the pixel part 104 as a displayelement, the light emitting element can also be applied to displaydevices formed with a pixel using other display elements. For example,the structure shown in the present embodiment can also be applied to aliquid crystal display device using liquid crystal elements as a displayelement.

Based on the display device described in the embodiments of the presentinvention, a person ordinarily skilled in the art could appropriatelyperform an addition or removal of structural components or designmodification or an addition of processes or an omission or change inconditions which are included in the scope of the present invention aslong as they do not depart from the subject matter of the presentinvention.

In addition, other effects that are different from those provided by theembodiments described above are obvious from the description in thespecification, and effects that could be easily conceived of by a personordinarily skilled in the art should be interpreted as also beingprovided by the present invention.

What is claimed is:
 1. A semiconductor device comprising: a flexiblesubstrate having a first surface and a second surface opposite of thefirst surface; a first part having thin film transistors on the firstsurface of the flexible substrate; a second part having terminals on thefirst surface of the flexible substrate; a resin film covering the firstpart; and a support member on the second surface of the flexiblesubstrate, a first portion of the support member overlapping with thefirst part, wherein the flexible substrate includes a curved partbetween the first part and the second part, an organic film covers thefirst surface of the flexible substrate at the curved part, the resinfilm has an edge at the curved part side, the organic film is in contactwith the edge of the resin film at the curved part side, the organicfilm does not overlap with the first part, the first portion of thesupport member has an edge overlapping with the curved part, and theedge of the resin film is between the first part and the edge of thepart of the support member.
 2. The semiconductor device according toclaim 1, wherein the support member has a second portion overlappingwith the second part.
 3. The semiconductor device according to claim 1,wherein the organic film is not in contact with an upper surface of theresin film.
 4. The semiconductor device according to claim 1, whereinthe organic film covers the second surface of the flexible substrate atthe curved part, and the organic film is in contact with the edge of thefirst portion of the support member.
 5. The semiconductor deviceaccording to claim 1, wherein a thickness of the organic film is smallerthan that of the resin film.
 6. The semiconductor device according toclaim 1, wherein the second portion of the support member has an edge atthe curved part, and the organic film on the first surface overlaps withthe edge of the first portion of the support member and the edge of thesecond portion of the support member in a plan view.
 7. Thesemiconductor device according to claim 1, further comprising a wiringsubstrate connected to the terminals at the second part, wherein theorganic film is between the edge of the resin film and the wiringsubstrate.